Enhanced boiling heat transfer from electronic components by use of surface microstructures

By H. Honda, J. J. Wei. 2004

174 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/3afbbc7a8ac8fd778debe4086413a2eec06034d9

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In Computational Mechanics

In Mechanical Engineering

Citations in the corpus

Review of pool boiling enhancement by surface modification (2019, background): “As to improving ability to tackle high surface heat fluxes, Anderson and Mudawar [8], Honda et al. [149], and Wei et al. [154] all recommended using micro-fin surfaces in conjunction with subcooling.”
Boiling heat transfer in a hydrofoil-based micro pin fin heat sink (2007, background): “Honda and co-workers in several recent publications [74–76] utilized successfully micro pin fins to augment the critical heat flux (CHF) conditions in electronic components.”
Microchannel size effects on local flow boiling heat transfer to a dielectric fluid (2008, background): “Although there have been a number of studies on pool boiling of perfluorocarbon liquids and the effect of surface enhancement [8], investigations of flow boiling in microchannels using perfluorocarbon liquids are limited.”
Saturated pool boiling enhancement using porous lattice structures produced by Selective Laser Melting (2018, background): “Surface modification A thorough literature review on the use of surface microstructures for pool boiling enhancement was performed by Honda and Wei [1].”
Effects of channel dimension, heat flux, and mass flux on flow boiling regimes in microchannels (2009, methodology): “Huo et al. (2004) also found that reducing the tube diameter shifts the transition of slug to churn and churn to annular flow to higher values of gas velocity. This dependence of the flow transition on channel size makes the flow maps in the literature limited to the test conditions and channel dime”
Hydrophilic and hydrophobic materials and their applications (2018, background): “It is being implemented in a broad range of power generation and thermal management devices, such as nuclear power plants, refrigeration, cooling of electronics and chemical reactors (Honda and Wei 2004; Lee and Mudawar 2005; Li et al. 2008; Nauman 2002).”
Pool boiling heat transfer of ultra-light copper foam with open cells (2008, methodology): “Honda and Wei (2004) gave a review on the enhanced boiling heat transfer from electronic components by use of surface micro-structures.”
Enhancing the onset of pool boiling by wettability modification on nanometrically smooth surfaces (2013, background): “The shape of the cavity is also of primary importance [7–9] for the nucleation.”
A Review of Cooling in Microchannels (2011, background): “When compared to a smooth surface, the optimal effect of the phase change phenomena ideally produced by microstructures or microcavities in the surface is to have a lower boiling incipience, decrease the surface temperature, increase the CHF, and increase the evaporation to obtain more nucleation bu”