Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

By J. Perelaer, Patrick J. Smith, D. Mager, D. Soltman, S. Volkman, V. Subramanian, Jan G. Korvink, Ulrich S. Schubert. 2010

709 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/3a1eeb501ad3e3644b89d84225adaeeb0666b7a4

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Leandro Lorenzelli
2. Ravinder S. Dahiya
3. Saleem Khan
4. Seeram Ramakrishna

In Electrical and Electronic Engineering

1. Ravinder S. Dahiya
2. Saleem Khan
3. Leandro Lorenzelli
4. Seeram Ramakrishna

Citations in the corpus

• 3D Printing of Highly Pure Copper (2019, methodology): “As the MOD ink is particle-free [93,94] it can avoid the common issues found in the BJ process using particle suspensions such as particle oxidation, sedimentation, and nozzle clog problems.”