Recent advances in polymer-based electronic packaging materials

By Yan-Jun Wan, Gang Li, Yimin Yao, Xiaoliang Zeng, Pengli Zhu, R. Sun. 2020

185 citations recorded by the source corpus.

Abstract High-density integration and packaging technologies are highly desired to integrate more functionality into a smaller form factor with improved performance, in which the polymer-based electronic packaging materials play a key role. In this short review, we will give a brief summarization of some key polymer-based electronic packaging materials, including flip-chip underfill, thermal interface material, dielectric material and EMI shielding material. The key factors influencing the performance of polymer-based electronic packaging materials, such as the surface modification of filler, orientation of polymer chains and microstructures of materials are discussed. In addition, prospective research opportunities toward the development of advanced polymer-based electronic packaging materials are highlighted and the challenges and outlook of polymer composites for electronic packaging are prospected.

Subfields: Biomedical Engineering, Electronic, Optical and Magnetic Materials, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/35f438a5ad658a7bbb209755012612e6bc0134f2