Intermetallic phase formation in diffusion-bonded Cu/Al laminates

By Ya-jie Guo, Guiwu Liu, H. Jin, Zhongqi Shi, G. Qiao. 2011

191 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/35bf1913ef0a725992ae16509f63382de3236da1