Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

By Xiaowu Hu, Tao Xu, Leon M. Keer, Yulong Li, Xiongxin Jiang. 2016

138 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/34f9124979a5cd417655335f9b3018734ad736bc