Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)

By Kuo-Shen Chen, A. Ayón, Xin Zhang, S. Spearing. 2002

261 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/3362306cc464d3ca50b0ee3199f3409dd1ec42ee

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. George M. Whitesides
2. Eric M. Yeatman
3. Stephen R. Quake
4. Nam-Trung Nguyen
5. Demetri Psaltis
6. Zhenyu Li
7. G. Vladisavljević
8. M. Gijs

In Electrical and Electronic Engineering

1. George M. Whitesides
2. Eric M. Yeatman
3. G. Vladisavljević
4. Demetri Psaltis
5. Zhenyu Li
6. A. Molinari
7. Giuseppina Bozzuto

Citations in the corpus

• Surface tension-powered self-assembly of microstructures - the state-of-the-art (2003, methodology): “Etching of extremely deep structures is now well understood, both using the cyclic etch-passivate DRIE process [34] and with the alternative cryogenic DRIE process [35].”