A study on wafer level vacuum packaging for MEMS devices

By Byeungleul Lee, Seonho Seok, K. Chun. 2003

161 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/2f5fba2f364c8cabc3567b93935a8f88da6acd7e