Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy

By Ping Liu, P. Yao, Jim Liu. 2008

145 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/2ac8541bb2d6c8112423cbcf2224a046689a8c4d