Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins

By S. Rimdusit, H. Ishida. 2000

290 citations recorded by the source corpus.

Subfields: Mechanical Engineering, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/2a5dc33032d1ade70ad161caf5e2521bf0064ceb

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Mechanical Engineering

1. B. Kiskan
2. Narendra Nath Ghosh
3. Y. Yagcı
4. H. Ishida

In Polymers and Plastics

1. B. Kiskan
2. Narendra Nath Ghosh
3. Y. Yagcı
4. H. Ishida

Citations in the corpus

• Polybenzoxazines-New high performance thermosetting resins : Synthesis and properties (2007, background): “[175] the appearance of two exotherms in the DSC plots of binary mixture of benzoxazine and epoxy resins was due to the existence of at least two reactions: (i) curing reaction among benzoxazine monomers for the first exotherm, at the temperature range of about 240–250 1C, and (ii) the second exothe”