Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

By Hui Xu, Changqing Liu, Vadim V. Silberschmidt, S. Pramana, Timothy J. White, Zhong Chen, V. Acoff. 2011

235 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/2a2a8f032168fb47fc8a5bffe167e450bd5579fc