Reliability of thermal interface materials: A review

By Jens Due, Anthony J. Robinson. 2013

229 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/283aee077ecf628326e8a70b1e8d98e21d636670

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. G. Cross

In Materials Chemistry

1. Anthony J. Robinson
2. G. Cross
3. Johan Liu
4. Kafil Mahmood Razeeb
5. J. Hansson
6. Eric E. Dalton

In Mechanical Engineering

1. Anthony J. Robinson
2. G. Cross
3. Kafil Mahmood Razeeb
4. Eric E. Dalton

Citations in the corpus

• Present and future thermal interface materials for electronic devices (2018, background): “resent the performance in practical application [4].”
• Novel nanostructured thermal interface materials: a review (2018, background): “[5] have proposed guidelines for screening and selecting TIMs based on a mixture of common charac-”