Diffusion barrier properties of AlMoNbSiTaTiVZr high-entropy alloy layer between copper and silicon

By Ming-Hung Tsai, Jien‐Wei Yeh, J. Gan. 2008

187 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/27d79b5cb662a740213089d126f688f330a206d0

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Aerospace Engineering

1. Daniel B. Miracle
2. Oleg N. Senkov
3. Jien‐Wei Yeh
4. Ming-Hung Tsai
5. P. K. Liaw
6. N. Jones
7. E. Pickering
8. Yong Zhang

In Mechanical Engineering

1. Daniel B. Miracle
2. Oleg N. Senkov
3. Jien‐Wei Yeh
4. Ming-Hung Tsai
5. P. K. Liaw
6. N. Jones
7. E. Pickering
8. Yong Zhang

In Mechanics of Materials

1. Daniel B. Miracle
2. Oleg N. Senkov
3. Ming-Hung Tsai
4. Jien‐Wei Yeh
5. Yong Zhang

Citations in the corpus

• High-Entropy Alloys: A Critical Review (2014, background): “[2,20,21] It also contributes to the excellent performance of HEA coatings as diffusion barriers.[22, 23] Moreover, it allows better high-temperature strength and structural stability, which are discussed in Section 5.”
• A critical review of high entropy alloys and related concepts (2016, result): “5CoCrCuFeNi avoids formation of low-temperature phases [166], and AlMoNbSiTaTiVZr is a better diffusion barrier than TaN/ TiN or Ru/TaN [219] e both of these results have been used to support the sluggish diffusion hypothesis.”