Thermal Challenges in Next-Generation Electronic Systems

By Yogendra K. Joshi, Suresh V. Garimella. IEEE transactions on components and packaging technologies, 2003

446 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/27cb7d740384e2250793c9d1052f5cd98ca9fe7f

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In Electrical and Electronic Engineering

1. R. Salgado
2. C. Wong
3. J. Renteria
4. Alexander A. Balandin
5. Ping Cheng
6. S. Legedza
7. Yangyang He
8. Qing Li

Citations in the corpus

• Start-up, heat transfer and flow characteristics of silicon-based micro pulsating heat pipes (2012, background): “At the present time, thermal control of electronic chips remains to be a great challenge due to the continuous increasing heat flux to be dissipated with diminishing space associated with rapid advances in the microelectronic integration technology [1,2].”
• Topology optimization of a pseudo 3D thermofluid heat sink model (2018, unknown): “This paper focuses on the design of air-cooled heat sinks as used for micro-electronics cooling since thermal management is increasingly becoming a bottleneck for advancement in the design of these systems [1].”
• Graphene Thermal Properties: Applications in Thermal Management and Energy Storage (2014, background): “To reduce the temperature rise in a computer chip, one uses thermal interface materials (TIMs) or heat spreaders that facilitate heat transfer from the chip to the heat sink [15,24,25].”
• Rough surfaces with enhanced heat transfer for electronics cooling by direct metal laser sintering (2014, background): “However, in the next-generation electronics devices, thermal performances of the air-cooled heat sinks must be further improved due to a steadily increasing power density, which makes the thermal management a great challenge still to be faced in the next future [4].”
• Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation (2014, background): “Thermal management is one of the most critical challenges in current electronic packaging in order to dissipate the large heat flux from high density/high power ICs and ensure high performance and long lifetime for the electronics [1–4].”
• Magnetically-Functionalized Self-Aligning Graphene Fillers for High-Efficiency Thermal Management Applications (2015, background): “Development of thenext generations of integrated circuits (ICs) and ultra-fast high-power transistors depend on efficient heat removal [3,4].”
• A review of small heat pipes for electronics (2016, background): “Moreover, emerging developed semiconductor devices such as Radio Frequency (RF) systems, high power Light-Emitting Diodes (LEDs), solar cells and solid-state laser light sources have all suffered large on-chip temperature gradients due to localized high heat flux resulting from the substantial non-u”
• Co-designing electronics with microfluidics for more sustainable cooling (2020, background): “Embedding liquid cooling directly 6 inside the chip is a promising approach for a more efficient thermal management [5], 7 [10], [11].”