A Time-Dependent Transport-Kinetics Model for Additive Interactions in Copper Interconnect Metallization

By R. Akolkar, U. Landau. 2004

155 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/2684871acefa2164185592326c695958b175d6eb