Timepix, a 65k programmable pixel readout chip for arrival time, energy and/or photon counting measurements
By X. Llopart, R. Ballabriga, M. Campbell, L. Tlustos, W. Wong. 2007
1,141 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Nuclear and High Energy Physics, Radiation
View Paper: https://www.semanticscholar.org/paper/264638a2700a29cc09aabb840596301d9e28ac1f
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In Electrical and Electronic Engineering
In Nuclear and High Energy Physics
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Citations in the corpus
- Physics and Detectors at CLIC: CLIC Conceptual Design Report (2012, methodology): “The target values for a detector at CLIC are derived from those for the ILC [19], namely a .”
- Conceptual design of the International Axion Observatory (IAXO) (2014, methodology): “tectors are used. The bump bond pads, which are usually used to connect the ASIC to the silicon sensor, are placed below the Micromegas and serve as charge collection pads. Currently the Timepix ASIC [75] is used as a readout chip, but the successor, Timepix3, is under development and will feature m”
- Gamma-rays from harmonically resonant betatron oscillations in a plasma wake (2011, methodology): “X-rays emitted in the highly damped stage (I) have spectra centred around 20 keV, which precluded the use of the CdTe detecto”
- Timepix3: a 65K channel hybrid pixel readout chip with simultaneous ToA/ToT and sparse readout (2014, methodology): “As shown in figure 4, the time stamp counter (40 MHz) is distributed into pixels using a global (one per double column (DC)) bus instead of using a shutter signal as timing reference (as in [1]).”