Negative thermal expansion: a review
By W. Miller, Christopher W. Smith, D. Mackenzie, Kenneth E. Evans. 2009
491 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/2545a28370ab9ddc17c5017862588904bd667e90
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In Electrical and Electronic Engineering
In Materials Chemistry
In Mechanical Engineering
Citations in the corpus
- Mechanical metamaterials associated with stiffness, rigidity and compressibility: a brief review (2017, methodology): “25) have been fabricated where their topologies ranging from chiral metamaterials [329,35], to cellular metamaterials [326], to rotating triangles or squares [322,330], and to needle shaped inclusions [331,332].”
- Phonons and Anomalous Thermal Expansion Behaviour in Crystalline Solids (2017, background): “[115] Miller W, Smith CW, Mackenzie DS, Evans KE.”
- Planar lattices with tailorable coefficient of thermal expansion and high stiffness based on dual-material triangle unit (2016, background): “However, their generalized mechanism is not yet understood and synthesizing these materials for engineering applications is not available (Miller et al., 2009).”