Polymer self assembly in semiconductor microelectronics

By Charles T. Black, Ricardo Ruiz, Gregory Breyta, Joy Y. Cheng, Matthew E. Colburn, Kathryn W. Guarini, Ho-Cheol Kim, Y. Zhang. International Electron Devices Meeting, 2006

395 citations recorded by the source corpus.

Integration of polymer self assembly with semiconductor processing enables sub-lithographic patterning of integrated circuit (IC) device elements and offers a non-traditional pathway to performance improvements (Black, 2005). We discuss target applications including surface-roughening for on-chip decoupling capacitors (Black et al., 2004), patterning nanocrystal floating gates for FLASH devices (Guarini et al., 2003), and defining FET channel arrays (Black, 2005)

Subfields: Biomedical Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/21ec34d040c7e8707f709ddafa95292288ab83ba

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Yu-Chih Tseng
2. Ricardo Ruiz
3. S. Darling
4. Z. Nie
5. Eugenia Kumacheva

In Materials Chemistry

1. Yu-Chih Tseng
2. Ricardo Ruiz
3. S. Darling
4. Z. Nie
5. Eugenia Kumacheva

Citations in the corpus

• Bit-Patterned Magnetic Recording: Theory, Media Fabrication, and Recording Performance (2015, methodology): “We note that the specifications discussed here are exclusive to BPM technology and come in addition to those previously suggested for BCP lithography in general [47].”
• Patterning surfaces with functional polymers. (2008, methodology): “The applications of polymer-patterned surfaces can be tentatively organized into several categories: (1) the fabrication of light-emitting displays (LEDs), semiconductor microelectronics and plastic electronics1–3; (2) bio-related and medicinal research including the study of cells and tissue engine”
• Block Copolymer Nanostructures for Technology (2010, background): “Transferring the self-assembled BCP pattern into the supporting substrate constitutes the most common example [4,5], while templating of magnetic materials [6], nanoparticles [7-11], and continuous thin metal films [12] have all been reported.”