A review of microencapsulation methods of phase change materials (PCMs) as a thermal energy storage (TES) medium
By A. Jamekhorshid, S. M. Sadrameli, M. Farid. 2014
831 citations recorded by the source corpus.
Subfields: Mechanical Engineering, Polymers and Plastics
View Paper: https://www.semanticscholar.org/paper/20c2fc8827c60b73840bfb3d02b14319b6da75c9
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Mechanical Engineering
- Zhengguo Zhang
- X. Fang
- Ahmed Hassan
- Yulong Ding
- Yahao Hu
- Guijing Dou
- Mohammad Shakeel Laghari
- Jian Liu
In Polymers and Plastics
Citations in the corpus
- A review on heat transfer and hydrodynamic characteristics of nano/microencapsulated phase change slurry (N/MPCS) in mini/microchannel heat sinks (2018, neutral): “Further, most of the N/MPCS review articles [21-29] 20 concern the thermophysical properties, manufacturing methods and applications.”
- Phase Change Material (PCM) Microcapsules for Thermal Energy Storage (2020, background): “Shell materials play an important role in the morphology, mechanical properties, and thermal properties of the produced microcapsules [51] and can be classified according to the chemical nature into three categories of organic, inorganic, and organic-inorganic hybrid materials [22], as shown in Figu”
- Micro-Encapsulated Phase Change Materials: A Review of Encapsulation, Safety and Thermal Characteristics (2016, background): “In this process, an inorganic shell with high thermal conductivity is formed around the capsule which is the disadvantage for building applications [164].”
- A comprehensive review on sub-zero temperature cold thermal energy storage materials, technologies, and applications: State of the art and recent developments (2021, background): “Future work can also be done to develop standardized procedures to test the leakage and stability performance of microcapsules, which is crucial for further commercial development and acceptance [152].”