Intergranular fracture in nanocrystalline metals

By D. Farkas, H. Swygenhoven, P. Derlet. 2002

169 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/204b6db1f4de61f26029517997c1d0f6c13220af

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Yuntian Zhu
2. I. Ovid’ko
3. James R. Kermode
4. Peter Gumbsch
5. R. Valiev
6. E. Bitzek

In Materials Chemistry

1. I. Ovid’ko
2. Yuntian Zhu
3. R. Valiev
4. James R. Kermode
5. E. Bitzek
6. C. Tekoğlu
7. Florence Scheyvaerts
8. T. Pardoen

Citations in the corpus

• Review on superior strength and enhanced ductility of metallic nanomaterials (2018, background): “Besides, molecular dynamics simulations [258] demonstrate that nanocracks are nucleated at triple junctions near long cracks in NC nickel having grain size in the range 5–12 nm.”
• Atomistic aspects of fracture (2015, background): “Color coding is according to common neighbour analysis ing load by nucleation and coalescence of nanovoids on favorably oriented GBs ahead of the crack, similar to the fracture behaviour in fcc metals Farkas et al. (2002).”
• Multi-phase-field modeling of anisotropic crack propagation for polycrystalline materials (2017, unknown): “We can observe either only intergranular [18,50] or only transgranular crack propagation [31], or both of them [1].”
• Void growth and coalescence in single crystals (2010, methodology): “Gan et al. (2006) analyzed the lattice rotation around a cylindrical void inside a pure Al single crystal under compression. The lattice rotation measured by Electron Back Scattering Diffraction (EBSD) is a marker of the plastic activity. Recently, Xu et al. (2009) characterized the void shape evolu”