A Maximum in the Strength of Nanocrystalline Copper

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Mechanical properties of ultrahigh-strength gold nanowires (2005, background): “Molecular dynamics simulations suggest that grain boundaries in BNMs may source and sink dislocations without build up of a residual dislocation networ”
Deformation twinning in polycrystalline copper at room temperature and low strain rate (2006, background): “Recently, molecular dynamic (MD) simulations predicted that Al and Cu with grain size of several tens of nanometers should twin via the process of successive partial dislocation emission from grain boundaries (GBs) and GB junctions [21–23].”
Characterizing and Modeling Mechanical Properties of Nanocomposites-Review and Evaluation (2010, background): “Schiotz and Jacobsen [231] investigated nanocrystalline copper, and pointed out that there may be a maximum in the strengthening that can be obtained by decreasing the grain size, so that below a certain critical grain size the strength begins to decrease again as the grain size decreases.”
The Hall–Petch and inverse Hall–Petch relations and the hardness of nanocrystalline metals (2019, background): “This transition has been seen to occur at grain sizes from around 100 nm [18] down to 10 nm [27, 84, 85, 88].”