Group III nitride and SiC based MEMS and NEMS: materials properties, technology and applications
By V. Cimalla, J. Pezoldt, Oliver Ambacher. 2007
348 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electrical and Electronic Engineering, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/1efa5dca2d6549a24e4839ba7f1845b234ac62e7
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In Condensed Matter Physics
In Electrical and Electronic Engineering
Citations in the corpus
- Gallium Nitride as an Electromechanical Material (2014, methodology): “3 shall be shifted by −1 GPa.”
- X-ray diffraction of III-nitrides (2009, background): “i Average value from all references reviewed in [90].”
- The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review (2015, background): “Table I lists the properties of the most common single crystalline SiC poly-types (3C-SiC, 4H-SiC, and 6H-SiC) in comparison to Si, the conventional MEMS material, and other wide energy gap materials such as diamond and GaN [20], [31], [32].”