A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

By Y. Morisada, T. Nagaoka, M. Fukusumi, Y. Kashiwagi, Mari Yamamoto, M. Nakamoto. 2010

136 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/1e75798721f079dcf99bdf148f27a71ac1ebbf27