Transient Chip-Package Cosimulation of Multiscale Structures Using the Laguerre-FDTD Scheme

By Myunghyun Ha, K. Srinivasan, M. Swaminathan. IEEE Transactions on Advanced Packaging, 2009

47 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/1e4f4ae3e3b402be16e814944e1dc1e6d290322a