Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

By Xiangdong Liu, H. Nishikawa. 2016

138 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/1dabe3f595818341b7ad11b8d9d77557d21d88e6