Vertical particle alignment of boron nitride and silicon carbide binary filler system for thermal conductivity enhancement

By Kiho Kim, Hyun Ju, Jooheon Kim. 2016

140 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/1cdf0ce72c655d998b4210f2ebc59c4b6d689844