Wafer bonding using microwave heating of parylene intermediate layers

By H. Noh, Kyoung-Sik Moon, A. Cannon, P. Hesketh, C. Wong. 2004

163 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/1bb20b6455b9362975fcaedc5edece775365607d

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Arun Majumdar

In Electrical and Electronic Engineering

1. A. McGaughey

Citations in the corpus

• Stamp-and-stick room-temperature bonding technique for microdevices (2005, background): “[9] have demonstrated a conformal bonding process where intermediate parylene layers, deposited on the wafers to”