Layered Silicate Nanocomposites Based on Various High-Functionality Epoxy Resins: The Influence of Cure Temperature on Morphology, Mechanical Properties, and Free Volume

By O. Becker, Yi-bing Cheng, Russell J. Varley, G. Simon. 2003

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This paper investigates the relationship between cure temperature, morphology, and mechanical properties of di-, tri-, and tetrafunctional high-performance, epoxy layered-silicate nanocomposites. Wide-angle X-ray analysis (XRD) was carried out at different stages of cure to monitor organoclay exfoliation kinetics. It was found that some (small) degree of conversion was required to obtain significant intercalation. The nanocomposite morphology was also probed using transmission electron microscopy, XRD, and positron annihilation lifetime spectroscopy. The bifunctional DGEBA resin gave better exfoliation than the resins of higher functionalities. This is attributed to better catalysis of the intragallery reaction by the organo-ions which reside within the galleries. Higher cure temperatures were also found to improve clay delamination and simultaneously increased toughness and modulus in case of the DGEBA- and TGAP-based materials. Free volume properties did not vary significantly between resins or with cur...

Subfields: Materials Chemistry, Polymers and Plastics

View Paper: https://www.semanticscholar.org/paper/1a7e7652e02c7f5bdaa4808091353aa8bc303314

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In Materials Chemistry

In Polymers and Plastics

Citations in the corpus

Dielectric nanocomposites with insulating properties (2005, methodology): “Effects of nanostructuration were summarized in the reference [5] based on the literature published up to 2003 [10-28], as follow.”
Degradation of solid dielectrics due to internal partial discharge: some thoughts on progress made and where to go now (2005, background): “For instance it was found [ 54 ] that the introduction of 2-5 weight percent of nano filler in a polyamid strongly reduced the increase in surface roughness due to PD, see Figure 11. IEEE Transactions on Dielectrics and Electrical Insulation Vol.”
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