Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

By S. Wiese, A. Schubert, H. Walter, R. Dukek, F. Feustel, E. Meusel, B. Michel. 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001

160 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/19618878d91200754da020ee0fdfb5756dc9dc0e