Performance of water based CuO and Al2O3 nanofluids in a Cu–Be alloy heat sink with rectangular microchannels

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A comprehensive review on microchannel heat sinks for electronics cooling (2023, background): “By adding solid nanoparticles in the base fluid, the thermal conductivity of the mixture can be improved dramatically, which can contribute to the heat dissipation [79–82].”
Graphene nanoplatelets-silver hybrid nanofluids for enhanced heat transfer (2015, background): “Al2O3,CuO, ZnO, silver and zirconia were typically used in many nanofluids compared to other kinds of metal oxide nanomaterials [4–7].”
Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink (2015, background): “Fortunately, the microchannel heat sink (MCHS) proposed by Tuckerman and Pease [1] in 1981 can endure a heat flux as high as 790 W cm , which becomes a significant way for thermal management of microelectronic devices and attracts a great deal of attention [2–20].”
Numerical simulation of heat transfer and turbulent flow of water nanofluids copper oxide in rectangular microchannel with semi-attached rib (2016, background): “Email: Toghraee@iaukhsh.ac.ir Creative Commons CC-BY: This article is distributed under the terms of the Creative Commons Attribution 3.0 License (http://www.creativecommons.org/licenses/by/3.0/) which permits any use, reproduction and distribution of the work without further permission provided the”