Copper Metallization for High Performance Silicon Technology
By R. Rosenberg, D. Edelstein, Chao Hu, K. Rodbell. 2000
396 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
View Paper: https://www.semanticscholar.org/paper/1539c7a4c13f593c76369a95161087829a341706
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In Biomedical Engineering
In Electrical and Electronic Engineering
Citations in the corpus
- Dynamic microscopy of nanoscale cluster growth at the solid–liquid interface (2003, background): “Electrochemically deposited Cu films have been successfully developed for interconnects in integrated circuits, but continuing miniaturization requires us to deepen our understanding of nucleation, growth and coalescence, particularly in thin films and on polycrystalline substrate”