Parametric Study of Pool Boiling on Horizontal Highly Conductive Microporous Coated Surfaces

By Chen Li, G. P. Bud Peterson. 2007

192 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/14f89836e38c350eef4444ebdac05b06a69fa8ad

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In Computational Mechanics

In Mechanical Engineering

Citations in the corpus

Critical heat flux of pool boiling on Si nanowire array-coated surfaces (2011, methodology): “Li and Peterson [18] used highly conductive microporous coated surfaces made of Cu wire meshes to increase the capillary force, which results in a higher CHF.”
Effect of particle size on surface-coating enhancement of pool boiling heat transfer (2015, unknown): “Sintered copper wire screens of varying thickness, porosity, and mesh size were investigated by Li and Peterson [20] to determine their effects on boiling performance.”
Effects of nanowire height on pool boiling performance of water on silicon chips (2011, methodology): “The recent surface treatment methods include increasing the surface area with micro pin-fins [1], applying wicking structures to promote the liquid supply by capillary pumping [2,3], and depositing nano-particles or coating with nanomaterials [4e6].”
Review of pool boiling enhancement by surface modification (2019, background): “Li and Peterson proposed a list of mechanisms responsible for the heat transfer enhancement, including increased wetted area, increased nucleation site density, and intensified interaction among bubbles, as well as film evaporation and capillary action induced within the porous structure.”
Effect of open microchannel geometry on pool boiling enhancement (2012, methodology): “30mm 2007 [19] Chip 9 Chip 9 Groove Temp.”
Pool boiling enhancement through microporous coatings selectively electrodeposited on fin tops of open microchannels (2014, methodology): “available in literature [4,5,7,14–16].”
A Review On Transient Thermal Management of Electronic Devices (2021, background): “TDP is estimated as TDP ¼ Tj;max Tambient Rtot (1) where Tj,max, and Tambient are the maximum allowable junction temperature and ambient temperature, respectively, while Rtot is Table 1 List of conventionally employed thermal management techniques and their performance capabilities as reported in li”