Demonstration of an inverse Hall–Petch relationship in electrodeposited nanocrystalline Ni–W alloys through tensile testing

By A. Giga, Y. Kimoto, Y. Takigawa, K. Higashi. 2006

160 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/14c706b53b12f3f58fb1b6154208ffcaffb1f538

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Chang Q. Sun

In Materials Chemistry

1. Chang Q. Sun
2. P. Ferreira
3. C. Carlton

In Mechanics of Materials

1. Chang Q. Sun
2. P. Ferreira
3. C. Carlton

Citations in the corpus

• Thermo-mechanical behavior of low-dimensional systems: The local bond average approach (2009, methodology): “For the A–B alloy, the critical grain size is given by [459]”
• What is behind the inverse Hall–Petch effect in nanocrystalline materials? (2007, background): “In this paper, we report an explanation for the inverse Hall–Petch effect based on the statistical absorption of dislocations by grain boundaries, showing that the yield strength is dependent on strain rate and temperature and deviates from the Hall–Petch relationship below a critical grain size.”