Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system

By N. Bosco, F. Zok. 2004

219 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/14b4bbc874cc2892d4cb0d00c6d46ce6f7d8265d