Comparative study of thermally conductive fillers in underfill for the electronic components

By Woong-Sun Lee, Jin Yu. 2005

176 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/148518bd175d9140ecd0b95c35b5b484a16bb5d3

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Toshikatsu Tanaka
2. P. Jiang
3. Xingyi Huang

In Materials Chemistry

1. P. Jiang
2. Xingyi Huang
3. Toshikatsu Tanaka
4. Girish M. Joshi
5. C. Ramesh Kumar
6. M. Vadivelu
7. Shengtao Li
8. Jinliang He

Citations in the corpus

• Recently emerging trends in thermal conductivity of polymer nanocomposites (2016, unknown): “2012a, Lee and Yu 2005).”
• A review of dielectric polymer composites with high thermal conductivity (2011, background): “At a given level of loading, silica-based polymer composites usually show the lowest thermal conductivity when compared with composites containing other fillers [6].”
• Polymer composites for thermal management: a review (2016, background): “[36] At a given level of loading, silicon oxide exhibits low thermal conductivity when compared with all other oxide-based composites.[37] Beryllium oxide exhibits high thermal conductivity than any other non-metals except diamond, but commercially it is unattractive due to its high cost and toxicit”