A thermal-driven floorplanning algorithm for 3D ICs

By Jason Cong, Jieqian Wei, Yan Zhang. IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004., 2004

439 citations recorded by the source corpus.

Subfields: Computer Networks and Communications, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/13c852406e03239952f6849a721895698c87f0e2