Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

By Xin Deng, R. Sidhu, P. Johnson, Nikhilesh Chawla. 2005

175 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/1302cbef0326ca77ab1289b3648f00dbd006271e