Four decades of research on thermal contact, gap, and joint resistance in microelectronics

By M. Yovanovich. IEEE transactions on components and packaging technologies, 2005

341 citations recorded by the source corpus.

Subfields: Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/12752a6b7322c4ee07d8df4d37506b02b08aca04