Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations

By Jia Li, Qihong Fang, Liangchi Zhang, You-wen Liu. 2014

160 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/122f731df6897bffa443b3f575b90459e4663380