Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints

By R. Chromik, R. Vinci, S. Allen, M. Notis. 2003

178 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/114ef52c84cd6e6ab074280c32cb49d949ccb86d