Kapitza conductance and phonon scattering at grain boundaries by simulation

By P. Schelling, S. R. Phillpot ¶, Pawel Keblinski. 2004

241 citations recorded by the source corpus.

Subfields: Civil and Structural Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/0fdb248d448c04714fe37fd7ffbf765709243c23

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Civil and Structural Engineering

1. C. Monachon
2. L. Weber
3. Yong‐Wei Zhang
4. Gang Zhang
5. C. Dames
6. P. Hopkins

In Electrical and Electronic Engineering

1. Gang Zhang
2. Yong‐Wei Zhang
3. L. Weber
4. C. Monachon
5. C. Dames
6. Yongqing Cai

In Materials Chemistry

1. Yong‐Wei Zhang
2. C. Monachon
3. Gang Zhang
4. L. Weber
5. C. Dames
6. Robert J. Stevens
7. P. Norris
8. L. Zhigilei

Citations in the corpus

• Strain effects on thermoelectric properties of two-dimensional materials (2015, background): “Generally speaking, there is an interfacial thermal resistance between different types of materials [118].”
• Thermal Boundary Conductance: A Materials Science Perspective (2016, methodology): “This approach has been used in two ways: (a) lattice dynamics simulations (36, 53, 65) and (b) wave packet transmission calculations (66, 67).”
• Effects of temperature and disorder on thermal boundary conductance at solid-solid interfaces: Nonequilibrium molecular dynamics simulations (2007, background): “[32,55] and adjusting the initial velocity in order to obtain a coherent propagating wavepacket.”