Cooling a Microprocessor Chip

By Ravi Mahajan, Chia-Pin Chiu, Greg Chrysler. Proceedings of the IEEE, 2006

352 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0e4d1ec006ebc8faf5eb86836035488b2e29e9e9

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Citations in the corpus

Graphene related materials for thermal management (2019, background): “Traditional heat spreaders are typically made of metals such as aluminum and copper which are quite heavy [55, 56].”
Enhanced Heat Transfer in Biporous Wicks in the Thin Liquid Film Evaporation and Boiling Regimes (2012, background): “, for average chip power densities exceeding 100 W/cm(2) [1,2].”
Reduction of thermal conductivity in phononic nanomesh structures. (2010, methodology): “The TF and EBM devices were patterned by electron-beam lithography, and the NWA and NM devices by the superlattice nanowire pattern transfer (SNAP) techniqu”
Vapor chambers with jumping-drop liquid return from superhydrophobic condensers (2013, background): “Vapor chambers offer passive yet effective phase-change heat transfer in a planar form factor useful for microelectronics cooling [1–5].”
Recent advances in microscale pumping technologies: a review and evaluation (2008, methodology): “Further, by using liquid cooling, the heat generation and heat rejection components can be separated, releasing the convective surface area for ultimate heat rejection to the ambient from being constrained by the microprocessor area (Mahajan et al. 2006).”
On-chip cooling by superlattice-based thin-film thermoelectrics. (2009, background): “For instance, heat generation from silicon microprocessors is highly non-uniform, both spatially and temporally, with localized high heat fluxes ( >300 W cm is possible) that vary with workloa”