Power Cycle Testing of Power Switches: A Literature Survey

By Lakshmi GopiReddy, Leon M. Tolbert, Burak Ozpineci. IEEE transactions on power electronics, 2014

181 citations recorded by the source corpus.

Subfields: Control and Systems Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0d786ac55b03113325ac399b11044a9b79979785

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Control and Systems Engineering

1. Frede Blaabjerg
2. U. Choi
3. Søren Jørgensen
4. Xiongfei Wang
5. Friedrich Wilhelm Fuchs
6. Marco Liserre
7. Nils Hoffmann

In Electrical and Electronic Engineering

1. U. Choi
2. Frede Blaabjerg
3. Søren Jørgensen
4. Xiongfei Wang
5. Huai Wang
6. Marco Liserre
7. Friedrich Wilhelm Fuchs
8. Yun Wei Li

In Mechanical Engineering

1. Frede Blaabjerg
2. U. Choi
3. Søren Jørgensen

Citations in the corpus

• Review and analysis of SiC MOSFETs’ ruggedness and reliability (2020, background): “For example, bond-wire lift-off, or cracks can be concluded through a step change in Rds(on) during the test, and solder layer degradation can be evaluated by means of thermal impedance measurement [78].”
• Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress (2018, methodology): “In [31], different PC test methods have been introduced.”