Direct writing of copper conductive patterns by ink-jet printing
By B. Park, Dongjo Kim, Sunho Jeong, Jooho Moon, Jang Sub Kim. 2007
532 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/0d69fe5fe105ed1b188c97d1204cc02f346b9141
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Biomedical Engineering
In Electrical and Electronic Engineering
- J. Steinke
- Shlomo Magdassi
- A. Kamyshny
- Yi Huang
- Yongsheng Chen
- Xiangjian Wan
- Soojin Park
- Jiajie Liang
Citations in the corpus
- Metal-based Inkjet Inks for Printed Electronics (2011, methodology): “The polyol method, while using PVP as a stabilizer, was utilized in the preparation of Ag and Cu NPs (size range of 40-50 nm) as precursors of metal-based conductive inks [111-115].”
- Synthesis, growth mechanism and thermal stability of copper nanoparticles encapsulated by multi-layer graphene (2012, background): “Copper (Cu) nanoparticles, due to their relatively low cost and high electrical conductivity, exhibit high potential for replacing the noble metal nanoparticles used in conductive inks [11,12].”
- A Review of Conductive Metal Nanomaterials as Conductive, Transparent, and Flexible Coatings, Thin Films, and Conductive Fillers: Different Deposition Methods and Applications (2018, methodology): “There are many reports on producing ink from Ag NPs [13,14,29,56], Au NPs [34,38,57], Cu NPs [40,41], Al NPs [55], and Sn NPs [53], and subsequent deposition of conductive thin films and circuits from these nanomaterials by ink-jet printing methods [12,17,20,58,59].”