Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices

By Xiaojin Wei, Yogendra K. Joshi, M. Patterson. 2007

236 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0cd892ae8964f946f03999ebe4224b0cf40cb95d

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Mechanical Engineering

1. Wei‐Mon Yan
2. Tian-Hu Wang
3. C. Leng
4. Xiao-dong Wang
5. Masoud Afrand

Citations in the corpus

• Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink (2015, background): “Following Vafai and Zhu’s work, extensive studies focused on the DL-MCHS were conducted [22–37], which further justified the results indicated by Vafai and Zhu [22–24], demonstrated that the channel number [25,26], aspect ratios of the top and bottom channels [25–29], channel-to-pitch width ratio [2”