A cascade electrocaloric cooling device for large temperature lift
By Yuan Meng, Ziyang Zhang, Hanxiang Wu, Ruiyi Wu, Jianghan Wu, Haolun Wang, Qibing Pei. Nature Energy, 2020
155 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/0abe17d9bf5515b7649299ad0f9c1df44b8c0290
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Biomedical Engineering
Citations in the corpus
- A comprehensive review on microchannel heat sinks for electronics cooling (2023, background): “With the rapid development of electronic technology, the heat flux generated by the new generation of micro-electronic devices has reached 1500 W · cm − 2 [10, 11, 14], while the maximum heat flux dissipated by the air-cooling sys-tem is about 100 W · cm − 2 [7].”