Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

By Y. Ein‐Eli, D. Starosvetsky. 2007

198 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/0a315d9544cbb77b643ff6300860fb2772903eaf