Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction

By A. Arshad, H. M. Ali, Muzaffar Ali, Shehryar Manzoor. 2017

316 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0a0351277e45b201ead2f34255d6487c31cf3176

How researchers see this paper

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In Mechanical Engineering

1. Yuying Yan
2. Mark Jabbal
3. A. Arshad
4. P. Sardari

Citations in the corpus

• Transient Simulation of Finned Heat Sinks Embedded with PCM for Electronics Cooling (2020, background): “Recently, Arshad and his co-authors [22, 23, 24, 25, 26] conducted parametric experimental studies for square and circular profiles pin-fin heat sinks based on the number of fins, fin thickness and fin configuration filled with six different types of PCM of varying melting temperatures and latent he”