Fabrication and Characterization of the Capillary Performance of Superhydrophilic Cu Micropost Arrays

By Y. Nam, S. Sharratt, C. Byon, Sung Jin Kim, Yongho Sungtaek Ju. Journal of microelectromechanical systems, 2010

162 citations recorded by the source corpus.

Subfields: Computational Mechanics, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0969344844712279ceec021c3558681536fe2aa9

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Computational Mechanics

1. Y. Nam
2. Yongho Sungtaek Ju
3. M. Kaviany

In Electrical and Electronic Engineering

1. Y. Nam
2. G. Hwang
3. M. Kaviany

In Mechanical Engineering

1. Y. Nam
2. Yongho Sungtaek Ju
3. I. Catton
4. M. Kaviany

Citations in the corpus

• Planar vapor chamber with hybrid evaporator wicks for the thermal management of high-heat-flux and high-power optoelectronic devices (2013, methodology): “Further details of the models are provided in [8,9,13].”
• A comparative study of the morphology and wetting characteristics of micro/nanostructured Cu surfaces for phase change heat transfer applications (2013, methodology): “The powder wicks were fabricated by sintering Cu powder of diameter approximately 60 μm and the micropost wicks were microfabricated using the electrochemical deposition technique [24].”