Determining the elastic modulus and hardness of an ultra-thin film on a substrate using nanoindentation
By Han Li, J. Vlassak. 2009
187 citations recorded by the source corpus.
A data analysis procedure has been developed to estimate the contact area in an elastoplastic indentation of a thin film bonded to a substrate. The procedure can be used to derive the elastic modulus and hardness of the film from the indentation load, displacement, and contact stiffness data at indentation depths that are a significant fraction of the film thickness. The analysis is based on Yu’s elastic solution for the contact of a rigid conical punch on a layered half-space and uses an approach similar to the Oliver-Pharr method for bulk materials. The methodology is demonstrated for both compliant films on stiff substrates and the reverse combination and shows improved accuracy over previous methods.
Subfields: Atomic and Molecular Physics, and Optics, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/08497b332304a1c2d25b4de950977605b3470829
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In Atomic and Molecular Physics, and Optics
Citations in the corpus
- Control of biaxial strain in single-layer molybdenite using local thermal expansion of the substrate (2015, background): “using strain engineering to modify their optoelectronic properties. The effect of uniaxial tensile strain on the band structure of MoS 2 has been extensively studied by density functional theory(DFT) [7, 8, 9, 10] and by photoluminescence (PL) experiments. [11, 12, 13, 14] The effect of biaxial stra”