Thermal conductivity enhancement of PEG/SiO2 composite PCM by in situ Cu doping
By Bingtao Tang, Meige Qiu, Shufen Zhang. 2012
210 citations recorded by the source corpus.
Subfields: Materials Chemistry, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/0810ec9371681a485b7ced2021cb25652bb5bf86
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In Materials Chemistry
In Mechanical Engineering
Citations in the corpus
- Types, methods, techniques, and applications for microencapsulated phase change materials (MPCM): A review (2016, background): “[94] enhanced the thermal conductivity of PEG/SiO2 via in situ chemical reduction of CuSO4 through ultrasound-assisted sol-gel process, concluding that the Cu/PEG/SiO2 hybrid material have excellent thermal stability and a good-stable performance.”